Shenzhen pcb design and assembly for gsm antenna pcb

1, contract assembly manufacture service 2, Surface mount, PCBA prototype 3, DIP,auto insertion 4, electronics assembly  

contract assembly manufacture service, EMS , PCB assembly.

 

1, full turnkey solution( SMT, AI , PCBA , testing , casing and packing,)

2, fast response for quotation and prototyping and shorter lead time for delivery

3, professional engineering team on site production technical support and after sales service.

 

Specializing in Double Side PCB, Multi-Layer PCB, F4BK PCB, Ceramic PCB,  Rogers PCB, Aluminum PCB.

1.Single-sided, double-sided and multi-layer boards.

2.HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP

3.Fast turnaround Prototypes & mass production.

4.Lead time of 7-21 days, according to quantities and PCB types.

5.Lead free Materials (RoHS Compliant).

6.ISO9001& ISO 14000 & UL certified 

 * We can provide quickturn prototype and small quantity PCBs with short lead time. * The quality of Our products is excellent and stable. * We choose the best material for all our products. * We will send the boards to you by DHL, TNT, UPS, FEDEX and so on to saving the transport time. * For responsing promptly, we will reply your e-mail from 9: 00am to 23: 00pm by two shifts.

We sincerely hope to establish longtime and friendly business relationship with you. Good quality, reasonable price and the 5-Star service are guaranteed.

Pls. Send us PCB files or gerber data so that we can quote for you.

 

Fabric Capacity:

Place of Origin: ShenZhen China (Mainland)	Brand Name: RIDECON
Surface Finishing: HAL, Lead Free HAL, Immersion gold, OSP, Immersion tin, Immersion silver, etc	Soldermask: green, black, blue, white, yellow, purple, and matt, etc.	Legend: white, yellow, black, etc.

 

NO	Item	Craft Capacity
1	Layer	1-30 Layers
2	Base Material for PCB	FR4, CEM-1, Aluminium,TEFLON, , Halogen-free…
3	Rang of finish baords Thickness	0.21-7.0mm
4	Max size of finish board	900*900MM
5	Minimum Linewidth	0.1mm
6	Minimum Line space	0.1mm
7	Min space between pad to pad	0.1mm
8	Minimum hole diameter	0.1mm
9	Min bonding pad diameter	10mil
10	Max proportion of drilling hole and board thickness	1:12.5
11	Minimum linewidth of Idents	4mil
12	Min Height of Idents	25mil
13	Minimun thickness of soldermask	10um
14	Color of silk-screen	White, Black, Yellow ect.
15	E-Testing	100% E-Testing (High Voltage Testing);  Flying Probe Testing
16	Special technological requirement	Blind & Buried Vias and High Thickness copper
17	Thickness of Copper	0.5-14oz (18-490um)

 

 

Shenzhen pcb design and assembly for gsm antenna pcb